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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Freescale Semiconductor, Inc.
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High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure, On-Chip Signal Conditioned, Temperature Compensated and Calibrated
Motorola's MPXH6250A series sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The small form factor and high reliability of on-chip integration make the Motorola pressure sensor a logical and economical choice for the system designer. The MPXH6250A series piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. Features * Improved Accuracy at High Temperature * Available in Small and Super Small Outline Packages * 1.5% Maximum Error over 0 to 85C * Ideally suited for Microprocessor or Microcontroller-Based Systems * Temperature Compensated from -40 to +125C * Durable Thermoplastic (PPS) Surface Mount Package Application Examples * Industrial Controls * Engine Control/Manifold Absolute Pressure (MAP)
VS
MPXH6250A SERIES
INTEGRATED PRESSURE SENSOR 20 to 250 kPa (3.0 to 36 psi) 0.3 to 4.9 Volts Output
Freescale Semiconductor, Inc...
SUPER SMALL OUTLINE PACKAGE
MPXH6250A6T1 CASE 1317
MPXH6250AC6T1 CASE 1317A
PIN NUMBER
1 2 N/C VS Gnd Vout 5 6 7 8 N/C N/C N/C N/C
SENSING ELEMENT
THIN FILM TEMPERATURE COMPENSATION AND GAIN STAGE #1
GAIN STAGE #2 AND GROUND REFERENCE SHIFT CIRCUITRY
3 4
Vout
PINS 1, 5, 6, 7 AND 8 ARE NO CONNECTS GND
NOTE: Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is denoted by the chamfered corner of the package.
Figure 1. Fully Integrated Pressure Sensor Schematic
REV 0
Motorola Sensor Device Data Motorola, Inc. 2003
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MPXH6250A SERIES 1
Freescale Semiconductor, Inc.
MAXIMUM RATINGS(1)
Parametrics Maximum Pressure (P1 u P2) Storage Temperature Operating Temperature Output Source Current @ Full Scale Output(2) Offset(2) Symbol Pmax Tstg TA Io+ Io- Value 1000 -40 to +125 -40 to +125 0.5 -0.5 Units kPa C C mAdc mAdc
Output Sink Current @ Minimum Pressure
NOTES: 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. 2. Maximum Output Current is controlled by effective impedance from Vout to Gnd or Vout to VS in the application circuit.
OPERATING CHARACTERISTICS (VS = 5.1 Vdc, TA = 25C unless otherwise noted, P1 u P2.)
Characteristic Pressure Range Symbol POP VS Io Offset(2) (0 to 85C) (0 to 85C) (0 to 85C) (0 to 85C) Voff VFSO VFSS -- V/P Time(6) Time(7) tR -- -- Min 20 4.74 -- 0.133 4.826 4.552 -- -- -- -- -- Typ -- 5.1 6.0 0.204 4.896 4.692 -- 20.4 1.0 20 0.25 Max 250 5.46 10 0.274 4.966 4.833 1.5 -- -- -- -- Unit kPa Vdc mAdc Vdc Vdc Vdc %VFSS mV/kPa ms ms %VFSS
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Supply Voltage(1) Supply Current Minimum Pressure @ VS = 5.1 Volts
Full Scale Output(3) @ VS = 5.1 Volts Full Scale Span(4) @ VS = 5.1 Volts Accuracy(5) Sensitivity Response Warm-Up Offset
Stability(8)
NOTES: 1. Device is ratiometric within this specified excitation range. 2. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 3. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 4. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 5. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at 25C due to all sources of error including the following: * Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. * Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. * Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25C. * TcSpan: Output deviation over the temperature range of 0 to 85C, relative to 25C. * TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0 to 85C, relative to 25C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 8. Offset Stability is the product's output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test.
MPXH6250A SERIES 2
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Motorola Sensor Device Data
Freescale Semiconductor, Inc.
FLUORO SILICONE GEL DIE COAT P1 WIRE BOND LEAD FRAME THERMOPLASTIC CASE 100 nF VS Pin 2 MPXH6250A Vout Pin 4 GND Pin 3 ABSOLUTE ELEMENT SEALED VACUUM REFERENCE DIE BOND 47 pF 51 K to ADC DIE STAINLESS STEEL CAP
+5.1 V
Figure 2. Cross Sectional Diagram SSOP (not to scale) Figure 2 illustrates the absolute sensing chip in the basic Super Small Outline chip carrier (Case 1317).
Figure 3. Typical Application Circuit (Output Source Current Operation) Figure 3 shows a typical application circuit (output source current operation).
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5.0 4.5 4.0 OUTPUT (Volts) 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 MIN 20.0 31.5 43.0 54.5 66.0 77.5 89.0 100.5 112.0 123.5 135.0 146.5 158.0 169.5 181.0 192.5 204.0 215.5 227.0 238.5 250.0 Pressure (ref: to sealed vacuum) in kPa MAX TYP TRANSFER FUNCTION: Vout = Vs* (0.0040*P-0.040) Error VS = 5.1 Vdc TEMP = 0 to 85C
Figure 4. Output versus Absolute Pressure Figure 4 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for operation over 0 to 85C temperature range. The output will saturate outside of the rated pressure range. A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPXH6250A series pressure sensor operating characteristics, internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application.
Motorola Sensor Device Data
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MPXH6250A SERIES 3
Freescale Semiconductor, Inc.
Transfer Function (MPXH6250A)
Nominal Transfer Value: Vout = VS x (0.004 x P - 0.040) (Pressure Error x Temp. Factor x 0.004 x VS) VS = 5.1 0.36 Vdc
Temperature Error Band
4.0 3.0 Temperature Error Factor 2.0 1.0 0.0
MPXH6250A Series
Break Points Temp - 40 0 to 85 125 Multiplier 3 1 1.75
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-40
-20
0
20
40
60
80
100
120
140
Temperature in C NOTE: The Temperature Multiplier is a linear response from 0C to -40C and from 85C to 125C
Pressure Error Band
4.0 3.0 Pressure Error (kPa) 2.0 1.0 0.0 -1.0 - 2.0 - 3.0 -4.0 20 60 100 140 180 220 260 300 Pressure (in kPa) Error Limits for Pressure
Pressure 20 to 250 (kPa)
Error (Max) 3.45 (kPa)
ORDERING INFORMATION -- SUPER SMALL OUTLINE PACKAGE
Device Type Basic Element Options Absolute, Element Only Absolute, Element Only Ported Element Absolute, Axial Port Absolute, Axial Port Case No. 1317 1317 1317A 1317A MPX Series Order No. MPXH6250A6U MPXH6250A6T1 MPXH6250AC6U MPXH6250AC6T1 Packing Options Rails Tape and Reel Rails Tape and Reel Marking MPXH6250A MPXH6250A MPXH6250A MPXH6250A
MPXH6250A SERIES 4
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Motorola Sensor Device Data
Freescale Semiconductor, Inc.
SURFACE MOUNTING INFORMATION
MINIMUM RECOMMENDED FOOTPRINT FOR SUPER SMALL OUTLINE PACKAGES
Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts.
0.050 1.27 TYP 0.150 3.81
0.387 9.83
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0.027 TYP 8X 0.69 0.053 TYP 8X 1.35 inch mm
Figure 5. SSOP Footprint (Case 1317 and 1317A)
Motorola Sensor Device Data
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MPXH6250A SERIES 5
Freescale Semiconductor, Inc.
SUPER SMALL OUTLINE PACKAGE DIMENSIONS
2X
0.006 C A B 0.420 0.400 0.050 0.025 0.300 0.280 3 0.019 5 0.014 0.004 M C A B
8X NOTES: 1. ALL DIMENSIONS ARE IN INCHES. 2. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994. 3. DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006 INCHES PER SIDE. 4. ALL VERTICAL SURFACES TO BE 5 MAXIMUM. 5. DIMENSION DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE .008 INCHES MAXIMUM.
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A
B 3
0.300 0.280
0.298 0.278 .010
GAGE PLANE
0.165 0.145 0.010 0.002 0.004 DETAIL E C
SEATING PLANE
0.023 0.013 DETAIL E
10 0
CASE 1317-03 ISSUE B
MPXH6250A SERIES 6
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Motorola Sensor Device Data
Freescale Semiconductor, Inc.
SUPER SMALL OUTLINE PACKAGE DIMENSIONS (CONTINUED)
2X
0.006 C A B 0.420 0.400 0.050 0.025 0.345 0.325
NOTES: 1. ALL DIMENSIONS ARE IN INCHES. 2. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994. 3. DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006 INCHES PER SIDE. 4. ALL VERTICAL SURFACES TO BE 5 MAXIMUM. 5. DIMENSION DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE .008 INCHES MAXIMUM.
8X
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0.018 0.014
M
5 CAB
GAGE PLANE
A
B
0.345 0.325
0.004
.014
0.010 0.002
0.048 0.038 DETAIL E
10 0
0.130 0.110
0.200 0.180 0.390 0.370 3 0.300 0.280
0.004 DETAIL E C
SEATING PLANE
A
B 3
0.300 0.280
BOTTOM VIEW
CASE 1317A-01 ISSUE A
Motorola Sensor Device Data
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MPXH6250A SERIES 7
Freescale Semiconductor, Inc.
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Information in this document is provided solely to enable system and software implementers to use Motorola products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters that may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals", must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. MOTOROLA and the Stylized M Logo are registered in the US Patent and Trademark Office. All other product or service names are the property of their respective owners. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. E Motorola Inc. 2003
HOW TO REACH US: USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; P.O. Box 5405, Denver, Colorado 80217. 1-800-521-6274 or 480-768-2130 JAPAN: Motorola Japan Ltd.; SPS, Technical Information Center, 3-20-1, Minami-Azabu, Minato-ku, Tokyo 106-8573, Japan. 81-3-3440-3569 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Centre, 2 Dai King Street, Tai Po Industrial Estate, Tai Po, N.T., Hong Kong. 852-26668334 HOME PAGE: http://motorola.com/semiconductors
MPXH6250A SERIES 8
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Motorola Sensor Device Data
MPXH6250A

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